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semiconducting layer material
semiconducting layer material, Total:177 items.
In the international standard classification, semiconducting layer material involves: Electrical wires and cables, Semiconductor devices, Semiconducting materials, Insulating fluids, Testing of metals, Electronic components in general, Printed circuits and boards, Cutting tools, Test conditions and procedures in general, Vocabularies, Sports equipment and facilities, TESTING, Surface treatment and coating, Elements of buildings, Electromechanical components for electronic and telecommunications equipment, Linear and angular measurements, Rectifiers. Convertors. Stabilized power supply, Rubber and plastics products, Analytical chemistry, Conducting materials, Insulating materials, Power transmission and distribution networks, Inks. Printing inks, Welding, brazing and soldering, Plastics, Paints and varnishes, Integrated circuits. Microelectronics.
Group Standards of the People's Republic of China, semiconducting layer material
- T/CAS 374-2019 Semi-conductive buffer layer material for extruded insulated power cables with rated voltage above 26/35kV
- T/CASME 798-2023 Specialized processing tools for semiconductor materials
- T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
- T/HTSJ 012-2023 Sports areas with semi-prefabricated synthetic surfaces
- T/CEEIA 610-2022 Semi-conductive tapes for buffer layer of power cables of rated voltages 110 kV and above
- T/CNIA 0143-2022 Ultrapure Resin Vessels for Trace Impurity Analysis of Semiconductor Materials
- T/SHPTA 014.2-2021 Modified polypropylene insulating compounds and semi-conductive shielding compounds for power cables of rated voltages from 6kV up to 35kV – Part 2 : Semi-conductive shielding compounds for polypropylene insulating power cables of rated voltages fro
- T/SDAS 243-2021 Semi-conductive shielding material for extruded insulated cables with rated voltage 35kV and below
British Standards Institution (BSI), semiconducting layer material
- BS IEC 62047-31:2019 Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
- BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
- BS IEC 62899-202-4:2021 Printed electronics - Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
- BS IEC 62899-202-5:2018 Printed electronics - Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
- BS IEC 62899-202-10:2023 Printed electronics - Materials. Resistance measurement method for thermoformable conducting layer
- BS EN 61249-5-4:1997 Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Conductive inks
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
- BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
- 21/30428334 DC BS EN IEC 62899-203. Printed electronics. Part 203. Materials. Semiconductor ink
- BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
- BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
- BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
- BS EN 61249-8-8:1997 Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Temporary polymer coatings
- BS ISO 4525:2003 Metallic coatings - Electroplated coatings of nickel plus chromium on plastics materials
- DD ENV 61112-2002 Blankets of insulating material for electrical purposes
- BS 4601:1970 Specification for electroplated coatings of nickel plus chromium on plastics materials
- 18/30369151 DC BS EN 62899-202-7. Printed electronics. Part 202-7. Materials. Conductive ink. Measurement of peel strength for printed conductive layer on flexible substrate
- BS EN 62047-14:2012 Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials
- BS 3187:1978 Specification for electrically conducting rubber flooring
- BS IEC 62899-202:2016 Printed electronics. Materials. Conductive ink
German Institute for Standardization, semiconducting layer material
- DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
- DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
- DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
- DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
- DIN VDE 0472-512:1985 Testing of cables, wires and flexible cords; resistance between protective conductor and semi-conductive layer
- DIN 50437:1979 Testing of semi-conductive inorganic materials; measuring the thickness of silicon epitaxial layer thickness by infrared interference method
- DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
- DIN EN 62047-2:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
- DIN EN 62047-10:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
- DIN 50455-1:2009-10 Testing of materials for semiconductor technology - Methods for characterizing photoresists - Part 1: Determination of coating thickness with optical methods
- DIN EN 62047-18:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
- DIN SPEC 1994:2017-02 Testing of materials for semiconductor technology - Determination of anions in weak acids
- DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
- DIN 50455-1:2009 Testing of materials for semiconductor technology - Methods for characterizing photoresists - Part 1: Determination of coating thickness with optical methods
- DIN EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
- DIN EN 62047-6:2010-07 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
- DIN 50965:2020 Electroplated coatings - Tin-coatings on iron- and copper-materials
- DIN 50965:2020-04 Electroplated coatings - Tin-coatings on iron- and copper-materials
- DIN 53100:2007 Metallic coatings - Electroplated coatings of nickel plus chromium and of copper plus nickel plus chromium on plastics materials
- DIN EN 61249-5-4:1997 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings; section 4: Conductive inks (IEC 61249-5-4:1996); German version EN 61249-5-4:1996
- DIN 50453-2:1990 Testing of materials for semiconductor technology; determination of etch rates of etching mixtures; silicium-dioxid coating; optical method
- DIN 50449-2:1998 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, semiconducting layer material
- GB/T 14264-1993 Semiconductor materials-Terms and definitions
- GB/T 14264-2009 Semiconductor materials-Terms and definitions
- GB/T 1550-1997 Standard methods for measuring conductivity type of extrinsic semiconducting materials
- GB/T 31469-2015 Semiconductor materials cutting fluid
- GB/T 14844-1993 Designations of semiconductor materials
- GB/T 6616-2023 Non-contact eddy current method for testing semiconductor wafer resistivity and semiconductor film sheet resistance
- GB/T 3048.3-1994 Test methods for determining electrical properties of electric cables and wires.Measurement of volumeresistivity of semi-conducting rubbers and plastics
- GB/T 3048.3-2007 Test methods for electrical properties of electric cables and wires.Part 3: Test of volume resistivity of semi-conducting rubbers and plastics
- GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
- GB/T 6616-1995 Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage
国家市场监督管理总局、中国国家标准化管理委员会, semiconducting layer material
- GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials
- GB/T 14844-2018 Designations of semiconductor materials
- GB/T 36646-2018 Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy
Society of Automotive Engineers (SAE), semiconducting layer material
- SAE AMS3682B-1977 COATING MATERIAL, ELECTRICALLY CONDUCTIVE Silver - Organic Resin
- SAE AMS3682C-1991 COATING MATERIAL, ELECTRICALLY CONDUCTIVE Silver - Organic Resin
- SAE AMS3682D-1992 COATING MATERIAL, ELECTRICALLY CONDUCTIVE Silver - Organic Resin
- SAE AMS3634-1967 PLASTIC TUBING, ELECTRICAL INSULATION Polyolefin, Dual Wall, Semi-Rigid, Heat Shrinkable
SAE - SAE International, semiconducting layer material
Professional Standard - Electron, semiconducting layer material
- SJ/T 11067-1996 Commonly used terminology for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
- SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
- SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials
- SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
- SJ/T 10175-1991 Detail specification of multilayer ceramic dual in-line package for semiconductor integrated circuits
International Electrotechnical Commission (IEC), semiconducting layer material
- IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
- IEC 62047-31:2019 Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
- IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
- IEC 62899-202-5:2018 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
- IEC 62899-202-10:2023 Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
- IEC 62899-202-4:2021 Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
- IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
- IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
- IEC 62047-6:2009 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
- IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
RO-ASRO, semiconducting layer material
HU-MSZT, semiconducting layer material
Indonesia Standards, semiconducting layer material
Association Francaise de Normalisation, semiconducting layer material
- NF EN 62047-14:2012 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 14 : méthode de mesure des limites de formage des matériaux à couche métallique
- NF A91-113:2004 Non-conductive coatings on non-magnetic electrically conductive basis materials - Measurement of coating thickness - Amplitude-sensitive eddy current method.
- NF EN 62047-2:2006 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 2 : méthodes d'essais de traction des matériaux en couche mince
- NF EN 62047-18:2014 Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18 : méthodes d'essai de flexion des matériaux en couche mince
- NF C93-784*NF EN 61249-5-4:1997 Materials for interconnection structures. Part 5 : sectional specification set for conductive foils and films with or without coatings. Section 4 : conductive inks.
- NF EN 61249-5-4:1997 Matériaux pour les structures d'interconnexion - Partie 5 : collection de spécifications intermédiaires pour feuilles et films conducteurs avec ou sans revêtement - Section 4 : encres conductrices.
- NF C96-050-10*NF EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
- NF C96-050-18*NF EN 62047-18:2014 Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials
- NF C96-050-2*NF EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2 : tensile testing methods of thin film materials.
- NF EN 62047-6:2010 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6 : méthodes d'essais de fatigue axiale des matériaux en couche mince
- NF C96-050-21*NF EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21 : test method for Poisson's ratio of thin film MEMS materials
- NF C96-050-6*NF EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials
- NF EN 62047-21:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21 : méthode d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince
- NF ISO 10677:2011 Céramiques techniques - Sources lumineuses UV destinée aux essais des matériaux photocatalytiques semi-conducteurs
RU-GOST R, semiconducting layer material
- GOST 22622-1977 Semiconductor materials. Terms and definitions
- GOST 22265-1976 Conductor materials. Terms and definitions
- GOST 34395-2018 Paint Materials. Spark test method for continuity inspection of delectric coatings on conductive substrates
Professional Standard - Machinery, semiconducting layer material
- JB/T 6819.3-1993 Instrument material terminology - Resistance material, conducting material and electric contact material
- JB/T 8320-1996 Coated quartz glass tubes intended to be used in the production process of power semiconductor devices
- JB/T 3578-2007 General technical rules for epoxy coating material on sliding lead-rail
- JB/T 3578-1991 General technical rules for sliding guide rail epoxy coating materials
- JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
- JB/T 5781-1991 Sectioned radiator for power semiconductor devices. Technical specification
- JB/T 10738-2007 Semi-conductive shielding compound for power cables of rated voltages up to and including 35kV
Danish Standards Foundation, semiconducting layer material
- DS/EN ISO 2360:2004 Non-conductive coatings on non-magnetic electrically conductive basis materials - Measurement of coating thickness - Amplitude-sensitive eddy current method
- DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
- DS/EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
- DS/EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
- DS/ISO 4525:1987 Metallic coatings — Electroplated coatings of nickel plus chromium on plastics materials
- DS/EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Underwriters Laboratories (UL), semiconducting layer material
- UL 779-1990 Electrically conductive floorings
- UL 779-1995 UL Standard for Safety for Electrically Conductive Floorings Seventh Edition; Reprint with revisions through and including 11/22/2005.
- UL 779-2011 Electrically conductive floorings
AT-ON, semiconducting layer material
IEC - International Electrotechnical Commission, semiconducting layer material
- IEC 62047-31:2017 Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials (Edition 1.0)
Lithuanian Standards Office , semiconducting layer material
- LST EN ISO 2360:2004 Non-conductive coatings on non-magnetic electrically conductive basis materials - Measurement of coating thickness - Amplitude-sensitive eddy current method (ISO 2360:2003)
AENOR, semiconducting layer material
- UNE-EN ISO 2360:2004 Non-conductive coatings on non-magnetic electrically conductive basis materials - Measurement of coating thickness - Amplitude-sensitive eddy current method (ISO 2360:2003)
International Organization for Standardization (ISO), semiconducting layer material
- ISO 4525:1985 Metallic coatings; Electroplated coatings of nickel plus chromium on plastics materials
- ISO 4525:2003 Metallic coatings - Electroplated coatings of nickel plus chromium on plastics materials
Standard Association of Australia （SAA）, semiconducting layer material
- AS 1406:2004 Electroplated coatings - Nickel and chromium on plastics for decorative applications
Shaanxi Provincial Standard of the People's Republic of China, semiconducting layer material
- DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices
IETF - Internet Engineering Task Force, semiconducting layer material
- RFC 5705-2010 Keying Material Exporters for Transport Layer Security (TLS)
Korean Agency for Technology and Standards (KATS), semiconducting layer material
KR-KS, semiconducting layer material
- KS C IEC 62047-18-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
- KS C IEC 62047-22-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
ES-UNE, semiconducting layer material
- UNE-EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)
- UNE-EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
- UNE-EN ISO 2360:2018 Non-conductive coatings on non-magnetic electrically conductive base metals - Measurement of coating thickness - Amplitude-sensitive eddy-current method (ISO 2360:2017)
- UNE-EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials (Endorsed by AENOR in June of 2010.)
- UNE-EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)
YU-JUS, semiconducting layer material
- JUS C.T7.125-1991 Metaliic coatings. Electroplated coatings of nlckel plus chromium on plastici materials
- JUS N.C0.036-1980 Testing offlexible cords and cables. Measurements ofinsulation resistance, resistance of semi-conducting layers and surface resistance.
American National Standards Institute （ANSI), semiconducting layer material
- ANSI/ASTM D3004:2008 Specification for Extruded Crosslinked and Thermoplastic Semi-conducting, Conductor and Insulation Shielding Materials
- ANSI/UL 779-2011 Standard for Safety for Electrically Conductive Floorings
American Society for Testing and Materials (ASTM), semiconducting layer material
- ASTM D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
- ASTM D3004-97 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
- ASTM D3004-08(2020) Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
- ASTM E977-84(1999) Standard Practice for Thermoelectric Sorting of Electrically Conductive Materials
- ASTM E977-05(2019) Standard Practice for Thermoelectric Sorting of Electrically Conductive Materials
- ASTM D6095-05 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM D6095-06 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM D6095-12 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
Japanese Industrial Standards Committee (JISC), semiconducting layer material
- JIS H 8630:1987 Electroplated coatings on plastics materials for decorative purposes
- JIS H 8630:2006 Electroplated coatings on plastics materials for decorative purposes
- JIS C 5630-2:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials
- JIS C 5630-18:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials
- JIS C 5630-6:2011 Semiconductor devices -- Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials
AR-IRAM, semiconducting layer material
VN-TCVN, semiconducting layer material
- TCVN 7664-2007 Metallic coatings.Electroplated coatings of nickel plus chromium on plastics materials
ZA-SANS, semiconducting layer material
- SANS 4525:2007 Metallic coatings - Electroplated coatings of nickel plus chromium on plastics materials
European Committee for Electrotechnical Standardization（CENELEC）, semiconducting layer material
- EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
- EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
European Committee for Standardization (CEN), semiconducting layer material
机械电子工业部, semiconducting layer material
- JB 5781-1991 Technical conditions of profile radiators for power semiconductor devices
SE-SIS, semiconducting layer material
- SIS SS-ISO 4525:1986 Metallic coatings- Electroplated coatings of nickel plus chromium on plastics materials
VE-FONDONORMA, semiconducting layer material
Institute of Interconnecting and Packaging Electronic Circuits (IPC), semiconducting layer material
IPC - Association Connecting Electronics Industries, semiconducting layer material