L50 光电子器件综合 标准查询与下载

GB/T 18311.2-2001 纤维光学互连器件和无源器件 基本试验和测量程序 第3-2部分;检查和测量 单模纤维光学器件偏振依赖性

本标准旨在测定单模纤维光学器件对于偏振态变化的依赖性。本测量可适用于任何单模互连器件和无源器件，包括连接器、接头、耦合器、衰减器、隔离器和开关。本方法用于测量由于注入偏振态变化导致的总衰减范围。对分路器，本方法也可用于测量总耦和比范围。 本方法不能用于测量回波损耗的偏振依赖性。

Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 3-2: Examinations and measurements--Polarization dependence of a single--mode fibre optic device

GB/T 18310.39-2001 纤维光学互连器件和无源器件 基本试验和测量程序 第2-39部分;试验 对外界磁场敏感性

本标准规定了当外界磁场施加到器件上时对其光学性能变化的敏感性进行测量的试验方法。

Fibre optic interconnecting devices and passive components--Basic test and measurement procedures--Part 2-39: Tests-Susceptibility to external magnetic fields

GB/T 14137-1993 光纤机械式固定接头插入损耗测试方法

本标准规定了光纤机械式固定接头（以下简称“光纤接头”）在几种使用条件下插入损耗的测试方法。 所规定的光纤接头被设计用于单信道和多信道，或混合信道，或者两者兼有的网络结构。根据这种测试，对光纤接头插入损耗进行计算。可用于质量评定。 本标准适用于光纤机械式固定接头插入损耗的测试。

Optical fiber mechanical-type splice insertion loss test

GB 12565-1990 半导体器件 光电子器件分规范

Sectional Specification for Semiconductor Devices and Optoelectronic Devices

GB/T 12565-1990 半导体器件 光电子器件分规范 (可供认证用)

本规范应与其有关的总规范一起使用；本规范规定了评定半导体光电子器件所需的质量评定程序、检验要求、筛选顺序、抽样要求、试验和测试方法的细节。

Semiconductor devices--Sectional specification for optoelectronic devices

NB/T 11229-2023 风力发电机组 光电编码器技术规范

Wind turbine photoelectric encoder technical specifications

IEC 61290-1-3:2021 光学放大器. 试验方法. 第1-3部分: 光功率参数和增益参数. 光功率计法

This part of IEC 61290 applies to all commercially available optical amplifiers (OA) and optically amplified subsystems. It applies to OA using optically pumped fibres (OFA based on either rare- earth doped fibres or on the Raman effect), semiconductors (SOA), and waveguides (POW

Optical amplifiers - Test methods - Part 1-3: Power and gain parameters - Optical power meter method

ASTM F3095-17a 使用旋转激光二极管和闭路电视摄像机系统对管道和导管截面形状直接测量用激光技术的标准实施规程

4.1 Laser profiling assessment is a quality control tool for identifying and quantifying deformation, physical damage, and other pipe anomalies after installation, providing means and methods for determining the quality of workmanship and compliance with project specifications. Laser profiling capabilities include: 4.1.1 Measurement of the structural shape, cross sectional area and defects; 4.1.2 Collection of data needed for pipe rehabilitation or replacement design; and 4.1.3 Post rehabilitation, replacement or new construction workmanship verification. 4.2 A laser profile pre-acceptance and condition assessment survey provides significant information in a clear and concise manner, including but not limited to graphs and still frame digital images of pipe condition prior to acceptance, thereby providing objective data on the installed quality and percentage ovality, or degree of deformation, deflection or deviation, that is often not possible from an inspection by either a mandrel or only CCTV. 1.1 This practice covers the procedure for the post installation verification and acceptance of buried pipe deformation using a visible rotating laser light diode(s), a pipeline and conduit inspection analog or digital CCTV camera system and image processing software. The combination CCTV pipe inspection system, with cable distance counter or onboard distance encoder, rotating laser light diode(s) and ovality measurement software shall be used to perform a pipe measurement and ovality confirmation survey, of new or existing pipelines and conduits as directed by the responsible contracting authority. This standard practice provides minimum requirements on means and methods for laser profiling to meet the needs of engineers, contractors, owners, regulatory agencies, and financing institutions. 1.2 This practice applies to all types of material, all types of construction, or shape. 1.3 This practice applies to gravity flow storm sewers, drains, sanitary sewers, and combined sewers with diameters from 6 to 728201;in. (150 to 18008201;mm). 1.4 The Laser Light Diode(s) shall be tested, labeled and certified to conform to US requirements for CDRH Class 2 or below (not considered to be hazardous) laser products or certified to conform to EU requirements for Class 2M or below laser products as per IEC 60825-1, or both. 1.5 The profiling process may require physical access to lines, entry manholes and operations along roadways that may include safety hazards. 1.6 This practice includes inspection requirements for determining pipeline and conduit ovality only and does not include all the required components of a complete inspection. The user of this practice should consider additional items outside this practice for inspection such as joint gap measurement, soil/water infiltration, crack and hole measurement, surface damage evaluation, evaluati......

Standard Practice for Laser Technologies for Direct Measurement of Cross Sectional Shape of Pipeline and Conduit by Rotating Laser Diodes and CCTV Camera System

ASTM F3080-17a 使用非旋转激光投影仪和闭路电视摄像机系统对管道和导管截面形状测量用激光技术的标准实施规程

4.1 Laser profiling assessment is a quality control tool for identifying and quantifying deformation, physical damage, and other pipe anomalies after installation, providing means and methods for determining the quality of workmanship and compliance with project specifications. Laser profiling can be used for: 4.1.1 Measurement of the structural shape, cross sectional area and defects; 4.1.2 Collection of data needed for pipe rehabilitation or replacement design; and 4.1.3 Post rehabilitation, replacement or new construction workmanship verification. 4.2 A laser profile pre-acceptance and condition assessment survey provides significant information in a clear and concise manner, including but not limited to graphs and still frame digital images of pipe condition prior to acceptance, thereby providing objective data on the installed quality and percentage ovality, deformation, deflection or deviation, that is often not possible from an inspection by either a mandrel or CCTV only survey. 1.1 Laser profiling is a non-contact inspection method used to create a pipe wall profile and internal measurement using a standard CCTV pipe inspection system, 360 degree laser light projector, and special geometrical profiling software. This practice covers the procedure for the measurement to determine any deviation of the internal surface of installed pipe compared to the design. The measurements may be used to verify that the installation has met design requirements for acceptance or to collect data that will facilitate an assessment of the condition of pipe or conduit due to structural deviations or deterioration. This standard practice provides minimum requirements on means and methods for laser profiling to meet the needs of engineers, contractors, owners, regulatory agencies, and financing institutions. 1.2 This practice applies to all types of pipe material, all types of construction, and pipe shapes. 1.3 This practice applies to depressurized and gravity flow storm sewers, drains, sanitary sewers, and combined sewers with diameters from 6 to 72 in. (150 and 1800 mm). 1.4 This standard does not include all aspects of pipe inspection, such as joint gaps, soil/water infiltration in joints, cracks, holes, surface damage, repairs, corrosion, and structural problems associated with these conditions. 1.5 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.6 The profiling process may require physical access to lines, entry manholes, and operations along roadways that may include safety hazards. 1.7 This standard does not purport to address all of the safety concerns, if any, as......

Standard Practice for Laser Technologies for Measurement of Cross-Sectional Shape of Pipeline and Conduit by Non-Rotating Laser Projector and CCTV Camera System

DB44/T 1895-2016 半导体照明器件色差一致性在线快速评估方法

普通照明用的LED作为光源的半导体照明器件色差一致性在线快速评估方法，不包括有机发光二极管（简称OLED）作为光源的半导体照明器件

On-line rapid evaluation method for chromatic aberration consistency of semiconductor lighting devices

IEC 60191-6-13:2016 半导体装置的机械标准化.第6-13部分:小间距球栅阵列(FBGA)和小间距盘栅阵列(FLGA)用顶部开口型插座的设计指南

This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

BS EN ISO 13694:2015 光学和光子学.激光和激光设备.激光束功率(能量)密度分布的试验方法

Optics and photonics. Lasers and laser-related equipment. Test methods for laser beam power (energy) density distribution

DIN EN 60747-5-5:2015 半导体设备.分离式元件.第5-5部分:光电元件.光融合元件(IEC 60747-5-5-2007+A1-2013);德文版本EN 60747-5-5-2011+A1-2015

Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2007 + A1:2013); German version EN 60747-5-5:2011 + A1:2015

NF C93-801-1*NF EN 62007-1:2015 光纤系统用半导体光电器件.第1部分:基本额定值及特性用规范模板

Semiconductor optoelectronic devices for fibre optic system applications - Part 1 : specification template for essential ratings and characteristics

KS B ISO 13695:2015 光学和光子学.激光和其相关设备.激光光谱特性的试验方法

Optics and photonics — Lasers and laser-related equipment — Test methods for the spectral characteristics of lasers

KS B ISO 13694:2015 光学和光学仪器.激光和激光设备.激光束能量密度分布的试验方法

Optics and optical instruments — Lasers and laser-related equipment — Test methods for laser beam power[energy] density distribution

KS B ISO 11145:2015 光学和光子学.激光和激光设备.词汇和符号

Optics and optical instruments — Lasers and laser-related equipment — Vocabulary and symbols

KS B ISO 15367-2:2015 激光和激光相关设备.激光束波前形状测定用试验方法.第2部分:Shack.Hartmann传感器

Lasers and laser-related equipment — Test methods for determination of the shape of a laser beam wavefront — Part 2: Shark-Hartmann sensors

DIN EN 61730-1/A11:2015 光电(PV)模件安全合格鉴定.第1部分:结构要求;德文版本EN 61730-1-2007/A11-2014

Photovoltaic (PV) module safety qualification - Part 1: Requirements for construction; German version EN 61730-1:2007/A11:2014

BS ISO 13142:2015 电光系统. 高反射率测量用腔衰荡技术

Electro-optical systems. Cavity ring-down technique for high-reflectance measurement