L97 加工专用设备 标准查询与下载

SJ 21041-2016 低温共烧陶瓷多层基板制造 工艺设备通用规范

本规范规定了低温共烧陶瓷多层基板制造工艺设备(以下简称设备)的通用要求、质量保证规定、交货准备和说明事项。 本规范适用于低温共烧陶瓷多层基板制造工艺设备，其他微组装制造工艺设备亦可参照使用。

General specification for low temperature co-fired ceramic multi-layer substrate manufacturing process equipment

SJ 21042-2016 低温共烧陶瓷多层基板制造联线测试验证产品技术要求

本标准规定了低温共烧陶瓷(LTCC)多层基板生产线中工艺设备联线联试时使用的测试验证产品(样件)的技术要求。 本标准适用于低温共烧陶瓷多层基板生产线设备组线联试过程中使用的，对相关设备指标进行测试验证的中间产品(样件)，不适用最终的有预定用途的低温共烧陶瓷产品。

On-line testing and verified sample technical requirement of low temperature co-fired ceramicmulti-layer substratemanufacturing

SJ 21051-2016 热压超声楔焊机通用规范

本规范规定了热压超声楔焊机(以下简称设备)的通用要求、质量保证规定、交货准备和说明事项。 本规范适用于手动热压超声楔焊机的设计、生产、检验、验收和订购。

General specification for hot-press ultrasonic wedge bonder

BHMA A156.1-2013 枪托和铰链

BUTTS AND HINGES

SJ 20974-2007 钟罩式高温烧结炉通用规范

本规范规定了钟罩式高温烧结炉（以下简称钟罩炉）的技术要求、质量保证规定和交货准备等。 本规范适用于以下用途的钟罩炉：在自然气氛或在保护气氛中进行材料热处理，如：磁性材料、电子陶瓷、功能陶瓷等材料的烧结。 其它行业的类似设备可参照此规范执行。

Generic specification for high temperature sintering elevator furnace

JEDEC JEP179-2006 组装的固态表面贴装元件的测试驱使鉴定和故障机理分析

The JEDEC standard DDR2 SDRAM must satisfy the requirement of 85C tCASE(max) operation at all times (Byte 47, bits 4:7 = 0000). There is an optional, higher tCASE operation allowed, up to 95C (Byte 47, bits 4:7 = 1010). If the optional higher tCASE limit is supported, there are two options that may or may not be supported to enhance the higher tCASE limit. These two options are vendor determined: (1) Double refresh required, (2) High Temp SR supported. If the base DRAM, i.e. tCASE(max) of 85C is specified, the two optional features are not required (but must be set to a default zero value.)

Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface- Mount Components

BHMA A156.1-2006 切头和绞链

This Standard establishes requirements for lightweight, standard weight, heavy weight and detention hinges. Cycle tests, lateral and vertical wear tests, friction tests, strength tests, finish tests, and material and dimensional requirements are included.

Butts and Hinges

JEDEC JEP150-2005 组装的固态表面贴装元件的测试驱使鉴定和故障机理分析

The present solid state component level qualification procedures do not always ensure that the packaged component will operate reliably after assembly on printed wire boards (PWBs), or the like, since the free standing device level qualification may not induce the same thermomechanical stresses present in the post second level assembly state. As component interconnections decrease in size, e.g., the component is closer to the PWB; the interaction of the second level assembly becomes increasingly more likely on the component’s performance. This document demonstrates how to evaluate the effect of assembly level operations and structures on components. As such, this document pertains predominantly to the following set of solid state devices and component packages that are described in the Scope. Knowledge of and comparison with packaged component failure mechanisms and modes is needed between the free standing and the assembled state. To ensure an effective qualification methodology for this set of solid state surface-mounted components, testing shall be performed in both the free standing and assembled state, including attached heat sinks where applicable. It should be noted that peripheral leaded surfacemount components are not considered in this document because, in general, the thermomechanical stresses imparted to the component in its assembled state are minimal, due to the inherent flexibility of their leads.

Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface- Mount Components

SJ/T 11259-2001 制冷机低温泵总规范

本规范规定了压阻式过载传感器的技术要求、试验方法、检验规则与标志、包装、贮存、运输等方面的要求。 本规范适用于压阻式过载传感器的设计和生产，是该产品的基本依据。

General specification for refrigerator cryopump

JIS X 5310:1999 信息技术.与OSI数据物理层有关的管理信息元素

この規格は，日本工業規格で規定されたOSI物理層の動作に関する開放型ンステム内の管理情報を規定する。

Information technology -- Elements of management information related to the OSI Physical Layer

SJ/T 11215-1999 电子元件自动编带机通用规范

本标准规定了电子元件自动编带机的分类、要求、试验方法、检验规则及标志、包装、运输、贮存。 本标准适用于电子元件包装编带专用的自动编带设备。其他类型的编带设备也可参照使用。

Oeneral specifications of automatic taping machine for electronic components

ISO/IEC 10746-4:1998 信息技术.开放分布式处理.参考模型:体系结构语义

The rapid growth of distributed processing has lead to a need for a coordinating framework for the standardization of Open Distributed Processing (ODP). This Reference Model of ODP provides such a framework. It creates an architecture within which support of distribution, interworking, interoperability and portability can be integrated. The Basic Reference Model of Open Distributed Processing (RM-ODP), (see ITU-T Recs. X.901 to X.904 | ISO/IEC 10746), is based on precise concepts derived from current distributed processing developments and, as far as possible, on the use of formal description techniques for specification of the architecture. The RM-ODP consists of: - ITU-T Rec. X.901 | ISO/IEC 10746-1: Overview: Contains a motivational overview of ODP giving scooping, justification and explanation of key concepts, and an outline of ODP architecture. This part is not normative. - ITU-T Rec. X.902 | ISO/IEC 10746-2: Foundations: Contains the definition of the concepts and analytical framework and notation for normalized description of (arbitrary) distributed processing systems. This is only to a level of detail sufficient to support ITU-T Rec. X.903 | ISO/IEC 10746-3 and to establish requirements for new specification techniques. This part is normative. - ITU-T Rec. X.903 | ISO/IEC 10746-3: Architecture: Contains the specification of the required characteristics that qualify distributed processing as open. These are the constraints to which ODP standards must conform. It uses the descriptive techniques from ITU-T Rec. X.902 | ISO/IEC 10746-2. This part is normative. - ITU-T Rec. X.904 | ISO/IEC 10746-4: Architectural Semantics: Contains a formalisation of the ODP modeling concepts defined in ITU-T Rec. X.902 | ISO/IEC 10746-2, clauses 8 and 9, and a formalisation of the viewpoint languages of ITU-T Rec. X.903 | ISO/IEC 10746-3. The formalisation is achieved by interpreting each concept in terms of the constructs of the different standardized formal description techniques. This part is normative. The purpose of this Recommendation | International Standard is to provide an architectural semantics for ODP. This essentially takes the form of an interpretation of the basic modeling and specification concepts of ITU-T Rec. X.902 | ISO/IEC 10746-2 and viewpoint languages of ITU-T Rec. X.903 | ISO/IEC 10746-3, using the various features of different formal specification languages. An architectural semantics is developed in four different formal specification languages: LOTOS, ESTELLE, SDL and Z. The result is a formalization of ODP's architecture. Through a process of iterative development and feedback, this has improved the consistency of ITU-T Rec. X.902 | ISO/IEC 10746-2 and ITU-T Rec. X.903 | ISO/IEC 10746-3. An architectural semantics provides the additional benefits of: - assisting the sound and uniform development of formal descriptions of ODP systems; and - of permitting uniform and consistent comparison of formal descriptions of the same standard in different formal specification languages. Rather than provide a mapping from all the concepts of ITU-T Rec. X.902 | ISO/IEC 10746-2, this Recommendation | International Standard focuses on the most basic. A semantics for the higher level architectural concepts is provided indirectly through their definition in terms of the basic ODP concepts. Examples of the use of some of the formal specification languages in this report can be found in TR 10167 (Guidelines for the Application of ESTELLE, LOTOS and SDL). In the following clauses, the concepts are numbered in accordance with the scheme used in ITU-T Rec. X.902 | ISO/IEC 10746-2. This Recommendation | International Standard specifies an architectural semantics for ODP. This is required to: - provide formalisation of the ODP modelling concepts; - assist sound and uniform development of formal descriptions of standards for distributed systems; - act as a bridge between the ODP modelling concepts and the seman

Information technology - Open distributed processing - Reference model: Architectural semantics

SJ/T 11131-1997 蒸发镀膜设备基本参数系列

本标准规定了蒸发镀膜设备基本参数系列。 本标准适用于极限压力为3×10^(-3)P|(a)～5×10^(-6)P|(a)范围内的钟罩式和箱式蒸发镀膜设备。

Basic parameter series of evaporation plating equipment

SJ/T 11129-1997 滚剪设备通用规范

本标准规定了滚剪设备的要求、试验方法、检验规则和标志、包装、运输及贮存。 本标准适用于将厚度为0.02mm～2mm的金属带料纵向滚剪后卷绕成卷的滚剪设备。

General specification for roll slitting equipment

SJ/T 11130-1997 编织设备通用规范

本标准规定了编织设备的要求、试验方法、检验规则和标志、包装、运输贮存。 本标准适用于编织直径不大于60mm电线电缆屏蔽层的编织设备。

General specification for braiding equipment

SJ/T 10671-1995 精密丝网印刷机通用范围

本标准规定了精密丝网印刷机的定义、要求、试验方法、检验规则、标志包装运输贮存等。 本标准适用于电子元器件高精度图文印刷的丝印机。其他类型的丝印机也可参照使用。

General specification for precision sereen printer

SJ/T 31100-1994 离子束蚀刻机完好要求和检查评定方法

本标准规定子半导体器件生产用离子束蚀刻机的完好要求和检查、评定方法。 本标准适用于电子产品生产、科研用离子束蚀刻机。

Requirements of readiness and methods of inspection and assessment for ion beam etching machines

SJ/T 10519.32-1994 塑料注射模零件.支柱

本标准规定了塑料注射模支柱的结构尺寸、标记示例及技术要求。 本标准适用于塑料注射模各种模架的支柱。

Components of injection mould for plastics.Support pillar

SJ/T 10515.3-1994 塑封模具结构.定位结构

本标准规定了塑封模具导向结构形式、基本尺寸、应用方式。 本标准适用于SJ/T 10515.1塑封模具结构 典型结构规定的塑封模具。

Configuration of Plastic packaged mould.Locating configuration

SJ/T 10519.15-1994 塑料注射模零件.锁紧楔

本标准规定了塑料注射模锁紧楔的结构尺寸、标记示例及技术要求。 本标准适用于塑料注射模各种模架的锁紧楔。

Components of injection mould for plastics.Wedge lock