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ion sputter
ion sputter, Total:55 items.
In the international standard classification, ion sputter involves: Vacuum technology, FLUID SYSTEMS AND COMPONENTS FOR GENERAL USE, Analytical chemistry, Semiconducting materials, Products of non-ferrous metals, Electronic tubes, Electronic display devices, Non-ferrous metals, Pumps, Body care equipment, Electricity. Magnetism. Electrical and magnetic measurements, Protection against fire, Linear and angular measurements, Wastes, Occupational safety. Industrial hygiene, Radiation protection, Radiation measurements, Materials for aerospace construction.
Professional Standard - Electron, ion sputter
- SJ 1781-1981 Sputtering ion pump--Testing methods
- SJ 1779-1981 Ordinary two-electrode sputtering ion pump--Parameters series
- SJ 1780-1981 Ordinary two-electrode sputtering ion pump--Performance specification
Professional Standard - Machinery, ion sputter
German Institute for Standardization, ion sputter
- DIN 28429:2003 Vacuum technology - Acceptance specifications for getter ion pumps
- DIN 6801-1:2019-09 Procedures of dosimetry with probe-type detectors for proton and ion radiation - Part 1: Ionization chambers
- DIN IEC 60562:1980 Measurements of incidental ionizing radiation from electronic tubes
- DIN IEC 60562:1980-05 Measurements of incidental ionizing radiation from electronic tubes
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, ion sputter
- GB/T 25755-2010 Vacuum technology.Sputter-ion pumps.Measurement of performance characteristics
- GB/T 29658-2013 High-purity sputtering aluminium and aluminium alloy target used in electronic film
- GB/T 31227-2014 Test method for the surface roughness by atomic force microscope for sputtered thin films
- GB 12951-2009 Americium-241 alpha sources for ionization smoke fire detectors
- GB 16365-1996 Radiological protection standards for ionization smoke fire detectors
RU-GOST R, ion sputter
- GOST 5.1807-1973 Type-GIN-0,5-1M getter-ion pump. Quality requirements of certified products
- GOST 5.413-1970 The mater cooled diode type sputter-ion pump NMDI-01-1 (NIRD-100) with the power supply BP-150. Quality requirements for certified products
American Society for Testing and Materials (ASTM), ion sputter
- ASTM E1162-87(2001) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1162-87(1996) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1438-91(2001) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
- ASTM E1438-91(1996) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
- ASTM E1162-11(2019) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1162-06 Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
- ASTM F1709-97 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97(2002) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM E684-95(2000) Standard Practice for Approximate Determination of Current Density of Large-Diameter Ion Beams for Sputter Depth Profiling of Solid Surfaces
- ASTM E684-04 Standard Practice for Approximate Determination of Current Density of Large-Diameter Ion Beams for Sputter Depth Profiling of Solid Surfaces
- ASTM F1238-95(1999) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
- ASTM F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
Professional Standard - Non-ferrous Metal, ion sputter
- YS/T 819-2012 High-purity sputtering copper target used in electronic film
- YS/T 893-2013 High-purity sputtering titanium target used in electronic film
- YS/T 1025-2015 High-purity tungsten and tungsten alloy sputtering target used in electronic film
British Standards Institution (BSI), ion sputter
- BS ISO 17109:2015 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
- BS ISO 17109:2022 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter dept profiling using single and multi-layer thin…
- 21/30433862 DC BS ISO 17109 AMD1. Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and…
- BS ISO 22415:2019 Surface chemical analysis. Secondary ion mass spectrometry. Method for determining yield volume in argon cluster sputter depth profiling of organic materials
International Organization for Standardization (ISO), ion sputter
- ISO 17109:2015 Surface chemical analysis - Depth profiling - Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
- ISO 12239:2010 Smoke alarms using scattered light, transmitted light or ionization
- ISO 17109:2022 Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth p
- ISO 22415:2019 Surface chemical analysis — Secondary ion mass spectrometry — Method for determining yield volume in argon cluster sputter depth profiling of organic materials
Group Standards of the People's Republic of China, ion sputter
Occupational Health Standard of the People's Republic of China, ion sputter
- GBZ 122-2006 Radiological protection standards for ionization smoke fire detectors
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, ion sputter
- GB/T 12951-2009 Americium-241 alpha sources for ionization smoke fire detectors
国家市场监督管理总局、中国国家标准化管理委员会, ion sputter
- GB/T 41064-2021 Surface chemical analysis—Depth profiling—Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
International Electrotechnical Commission (IEC), ion sputter
- IEC TS 62743:2012 Radiation protection instrumentation - Electronic counting dosemeters for pulsed fields of ionizing radiation
Society of Automotive Engineers (SAE), ion sputter
IEC - International Electrotechnical Commission, ion sputter
- TS 62743-2012 Radiation protection instrumentation – Electronic counting dosemeters for pulsed fields of ionizing radiation (Edition 1.0)
RO-ASRO, ion sputter
- STAS 9475/9-1984 ION EXCHANGERS Determination of total capacity of anion exchangers
BR-ABNT, ion sputter
Defense Logistics Agency, ion sputter