L50 光电子器件综合 标准查询与下载

KS C IEC 61300-3-26:2004 纤维光学互连器件和无源元件.基本试验和测量程序.第3-26部分:检验和测量.光纤和金属加固环轴线间角度误差的测量

이 규격은 광섬유가 삽입된 단일 모드 광섬유 커넥터에서 광섬유 축과 원통 모양 페룰 축 사

Fibre optic interconnecting devices and passive components-Basic test and measurement procedures-Part 3-26:Examinations and measurements-Measurement of the angular misalignment between fibre and ferrule axes

JEDEC JESD22-B102D-2004 可焊性

This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages.

Solderability

JEDEC JESD22A111-2004 评估决定表面贴装类产品浸入焊料性能的程序

This evaluation procedure is written to provide USER’s of ICs of small surface mount packages with a method to evaluate the capability of a component to withstand full wave solder immersion.

Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices

ASTM E1171-04 在循环温度和湿度环境下测定光电模数的标准试验方法

1.1 These test methods provide procedures for stressing photovoltaic modules in simulated temperature and humidity environments. Environmental testing is used to simulate aging of module materials on an accelerated basis.1.2 Three individual environmental test procedures are defined by these test methods: a thermal cycling procedure, a humidity-freeze cycling procedure, and an extended duration damp heat procedure. Electrical biasing is utilized during the thermal cycling procedure to simulate stresses that are known to occur in field-deployed modules.1.3 These test methods define mounting methods for modules undergoing environmental testing, and specify parameters that must be recorded and reported.1.4 These test methods do not establish pass or fail levels. The determination of acceptable or unacceptable results is beyond the scope of these test methods.1.5 Any of the individual environmental tests may be performed singly, or may be combined into a test sequence with other environmental or non-environmental tests, or both. Certain pre-conditioning tests such as annealing or light soaking may also be necessary or desirable as part of such a sequence. The determination of any such sequencing and pre-conditioning is beyond the scope of this test method.1.6 These test procedures are limited in duration and therefore the results of these tests cannot be used to determine photovoltaic module lifetimes.1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Methods for Photovoltaic Modules in Cyclic Temperature and Humidity Environments

KS B ISO 11990:2003 激光和激光相关设备.气管导管耐激光性的测定.气管导管柄

이 규격은 통기관의 레이저 저항을 시험하는 방법에 대하여 규정한다. 인플레이션(infl

Optics and optical instruments-Lasers and laser-related equipment-Determination of laser resistance of tracheal tube shafts

KS B ISO 11551:2003 光学和光学仪器.激光和激光设备.光学激光组件光吸收性试验方法

이 규격은 광학 레이저 부품의 흡수율에 대한 비교 가능한 값을 구하는 절차와 기술에 대

Optics and optical instruments-Lasers and laser-related equipment-Test method for absorptance of optical laser components

KS B ISO 12005:2003 激光和激光设备.激光束参数的试验方法.偏振

이 규격은 연속광 레이저 빔에 대한 편광 상태와 가능할 경우에는 편광도를 결정하는 방법

Lasers and laser-related equipment-Test methods for laser beam parameters-Polarization

KS B ISO 11554:2003 光学和光子学.激光和激光设备.激光束功率、能量和时间特征的试验方法

이 규격은 연속 및 펄스 레이저의 출력 및 에너지, 그리고 펄스의 모양, 지속 및 반복

Optics and optical instruments-Lasers and laser-related equipment-Test methods for laser beam power, energy and temporal characteristics

SJ 20869-2003 铌酸锂集成光学波导调制器测试方法

Measuring methods for LiNbO3 integrated optical guided-wave modulators

KS B ISO 15004:2003 眼科仪器.基本要求和试验方法

이 규격은 비침투적(non-invasive), 능동형(active) 및 수동형(non-

Ophthalmic instruments-Fundamental requirements and test methods

ANSI/IPC 0040-2003 光电子学总装和包装工艺学

Addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or sub-assembly.

Optoelectronic Assembly and Packaging Technology

KS B ISO 15227:2003 光学和光学仪器.显微镜.体视显微镜的测试

이 규격은 스테레오 현미경에 대한 최소한의 요구 사항을 확인하기 위한 시험 조건과 추천

Optics and optical instruments-Microscopes-Testing of stereomicroscopes

IEC 61300-3-31:2003 光纤互连装置和无源器件 基本试验和测量程序 第3-31部分:检验和测量 纤维光学光源的耦合功率比测量

本部分规定了测量耦合功率比(CPR)系数的方法。按GB／T 18311．4—2003测量多模光纤衰减和 插入损耗时，CPR用于表征光源特性和使注入条件标准化。 可以在850 nm和1 300 am波长下测量CPR系数。

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-31: Examinations and measurements; Coupled power ratio measurement for fibre optic sources

IEC 61300-3-16:2003 光纤互联装置和无源部件.基本试验和测量程序.第3-16部分:检查和测量.套管球形抛光端面的曲率半径

本部分规定了一个测量球面抛光套管、倾角套管或倾角球面抛光套管的端面半径的程序。

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-16: Examinations and measurements - Endface radius of spherically polished ferrules

IEC 61300-3-30:2003 光纤互连器件和无源器件 基本试验和测量程序 第3-30部分:检查和测量 单套管多芯光纤连接器抛光角度和光纤位置

本部分规定了评定导销式多芯套管和连接器中端面几何结构的程序。 基本特性为：相对于端面的光纤位置（无论凹进或

Fibre Optic Interconnecting Devices and Passive Components - Basic Test and Measurement Procedures - Part 3-30: Examinations and Measurements - Polish Angle and Fibre Position on Single Ferrule Multifibre Connectors (Edition 1.0)

SJ 53930/1-2002 半导体光电子器件.GR8813型红外发射二极管详细规范

Semiconductor optoelectronic devices Detail specification for type GR8813 infrared emitting diode

IEC 61300-3-26:2002 光纤互连设备和无源元件.基本试验和测量程序.第3-26部分:检验和测量.光纤和金属加固环轴线间角度误差的测量

本部分规定了测量装有单模光纤的连接器的圆柱体插针中光纤与插针轴线间的角偏差的程序。 本部分规定了单模光纤连接器的圆柱体插针中光纤与插针轴线间的角偏差的测量方法。 角偏差定义为插针轴线与安装的光纤轴线（见图1）之间的夹角δ。 角偏差的测量是通过绕轴线旋转插针， 并测量插针在远场方位图中光斑中心的偏移量来完成。 在一个光纤连接器中， 其角偏差的特征值一般在十分之几度的范围内。 离插针表面5 mm 处的光斑(白光源）直径大约为1 mm。 当旋转连接器时， 光斑的偏移值大约为光斑直径的1/100（离光纤表面 5 mm 处角偏差0.5°对应的光斑偏移值为45μm）。 为了能在高精度水平上测量如此小的一个偏移值，就需要使用自动控制装置。 此外， 由光纤引起的光斑偏移还收到与插线轴线相关的光纤表面倾斜度的影响。这里的篇专职符合斯奈尔定律。 倾斜的影响程度可以通过曲率半径以及反射点偏心率来计算。 有关这个问题的注解和解释见附录A。

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-26: Examinations and measurements; Measurement of the angular misalignment between fibre and ferrule axes

JEDEC JESD22-B109-2002 倒装芯片张力

This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other materials that increase the apparent bond strength. It should be used to assess the consistency of the chip join process across a given flip chip die.

Flip Chip Tensile Pull

EN 60747-5-1:2001 半导体分立器件和集成电路 第5-1部分 光电子器件 总则 (包括修改件A1-2002 + A2-2002) (IEC 60747-5-1-1997 + A1-2001 + A2-2002)

This Part of IEC 60747 deals with the terminology relating to the semiconductor optoelectronic devices.

Discrete semiconductor devices and integrated circuits — Part 5-1: Optoelectronic devices — General (includes amendments A1:2002 + A2:2002) (IEC 60747-5-1:1997 + A1:2001 + A2:2002)

BS EN 60191-6-1:2002 半导体器件的机械标准化.表面安装的半导体器件封装外形图绘制的一般规则.海鸥翼式铅端子的设计指南

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals