31.200 集成电路、微电子学 标准查询与下载
共找到 3191 条与 集成电路、微电子学 相关的标准，共 213 页
Test methods for flip chip integrated circuits
- ICS
- 31.200
- CCS
- L55
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Semiconductor die products—Part 6: Requirements for concerning thermal simulation
- ICS
- 31.200
- CCS
- L55
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
本标准规定了电压调整器(以下称为器件)参数测试方法。 本标准适用于半导体集成电路领域中电压调整器参数的测试。
Semiconductor integrated circuits.Measuring method of voltage regulators
- ICS
- 31.200
- CCS
- L56
- 发布
- 2018-03-15
- 实施
- 2018-08-01
Microwave circuits—Measuring methods for voltage controlled oscillater
- ICS
- 31.200
- CCS
- L58
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Semiconductor die products—Part8: EXPRESS model schema for data exchange
- ICS
- 31.200
- CCS
- L55
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Semiconductor die products—Part 7: XML schema for data exchange
- ICS
- 31.200
- CCS
- L55
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Microwave circuits—Measuring methoels for noise source
- ICS
- 31.200
- CCS
- L58
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Logic digital integrated circuits—Specification for I/O interface model for integrated circuit
- ICS
- 31.200
- CCS
- L56
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Specification for serial NOR flash interface
- ICS
- 31.200
- CCS
- L56
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Semiconductor die products—Part 4: Requirements for die users and suppliers
- ICS
- 31.200
- CCS
- L55
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
- ICS
- 31.200
- CCS
- L56
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Test methods for endurance and data retention of non-volatile memory
- ICS
- 31.200
- CCS
- L56
- 发布
- 2018-03-15
- 实施
- 2018-08-01 00:00:00.0
Micro-electromechanical system technology—Measuring method for in-plane length measurements of MEMS microstructures using an optical interferometer
- ICS
- 31.200
- CCS
- L55
- 发布
- 2017-11-01
- 实施
- 2018-05-01 00:00:00.0
Micro-electromechanical system technology—Measuring method of microstructure surface stress based on Raman spectroscopy
- ICS
- 31.200
- CCS
- L55
- 发布
- 2017-11-01
- 实施
- 2018-05-01
Micro electromechanical system technology—Test method for the nonlinear vibration of the MEMS resonant sensitive element
- ICS
- 31.200
- CCS
- L55
- 发布
- 2017-11-01
- 实施
- 2018-05-01 00:00:00.0
Micro-electromechanical system technology—Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer
- ICS
- 31.200
- CCS
- L55
- 发布
- 2017-11-01
- 实施
- 2018-05-01 00:00:00.0
Micro-electromechanical system technology—Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer
- ICS
- 31.200
- CCS
- L55
- 发布
- 2017-11-01
- 实施
- 2018-05-01 00:00:00.0
Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances
- ICS
- 31.200
- CCS
- L55
- 发布
- 2017-07-12
- 实施
- 2018-02-01 00:00:00.0
Test methods of the performance for MEMS high g accelerometer
- ICS
- 31.200
- CCS
- L55
- 发布
- 2017-07-12
- 实施
- 2018-02-01 00:00:00.0
Nanotechnologies—Electrical operating parameter test specification of wafer level nano-scale phase change memory cells
- ICS
- 31.200
- CCS
- L56
- 发布
- 2017-05-12
- 实施
- 2017-12-01 00:00:00.0
