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Wafer inspection

Wafer inspection, Total:8 items.

In the international standard classification, Wafer inspection involves: Semiconducting materials, Testing of metals, Optics and optical measurements.

Group Standards of the People's Republic of China, Wafer inspection

• T/IAWBS 008-2019 Experimental method for residual stress in SiC wafers
• T/ZSA 38-2020 Experimental method for residual stress in SiC wafers
• T/CASAS 013-2021 Measuring method for testing the density of dislocation in SiC crystal Combined KOH etching and image recognition methods

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Wafer inspection

• GB/T 26066-2010 Practice for shallow etch pit detection on silicon
• GB/T 31351-2014 Nondestructive test method for micropipe density of polished monocrystalline silicon carbide wafers

Professional Standard - Aviation, Wafer inspection

• HB 7782-2005 Testing and evaluation method for recrystallization on directionally solidified blades

RU-GOST R, Wafer inspection

• GOST 8.215-1976 State system for ensuring the uniformity of measurements. Glass plates for interference measurements. Means and methods of verification

GOSTR, Wafer inspection

• GOST 8.215-2019 State system for ensuring the uniformity of measurements. Glass plates for the interference measurements. Verification procedure

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