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super chip

super chip, Total:35 items.

In the international standard classification, super chip involves: Galvanic cells and batteries, Vocabularies, Semiconducting materials, Integrated circuits. Microelectronics, Conducting materials, Iron and steel products, Resistors, Ceramics, Analytical chemistry, Valves, Shipbuilding and marine structures in general, Aerospace electric equipment and systems, Equipment for the chemical industry, Equipment for petroleum and natural gas industries, Fluid storage devices, Semiconductor devices.

Hebei Provincial Standard of the People's Republic of China, super chip

DB13/T 1633-2012 Solar Grade Polysilicon Wafer
DB13/T 1314-2010 Solar grade monocrystalline silicon square rod, monocrystalline silicon wafer
DB13/T 1828-2013 Solar grade monocrystalline silicon wafer

Professional Standard - Labor and Labor Safety, super chip

LD/T 94-1996 Honeycomb type overpressure rupture disc equipment for crystal kettle

Group Standards of the People's Republic of China, super chip

T/SZBX 018-2021 Products of Wafer Level Chip Scale Package
T/ZZB 2283-2021 Ultra-high purity graphite powder for semiconductor silicon carbide crystal
T/JSSIA 0004-2017 Outline Dimensions of Wafer Level Chip Scale Package
T/JSSIA 0003-2017 Series Programs for Wafer Level Chip Scale Package

劳动部, super chip

LD/T 0094-1996 Screw plug type ultra-high pressure bursting disc device for crystal kettle

国家市场监督管理总局、中国国家标准化管理委员会, super chip

GB/T 37051-2018 Test method for determination of crystal defect density in PV silicon ingot and wafer

Military Standard of the People's Republic of China-General Armament Department, super chip

GJB 2918-1997 Specification for detector grade high resistance zone fused silicon monoliths
GJB 2918A-2017 Specification for polished wafers of molten silicon single crystal in detector grade high resistance zone

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, super chip

GB/T 32516-2016 Ultra-high voltage graded controllable shunt reactor thyristor valve
GB/T 25188-2010 Thickness measurements for ultrathin silicon oxide layers on silicon wafers X-ray photoelectron spectroscopy
GB/T 25151.3-2010 Fabrication and inspection method for high pressure urea equipment.Part 3:Intergranular corrosion tendency test for ultra low-carbon chromated nickel molybdenum austenitic stainless steel of urea grade

Korean Agency for Technology and Standards (KATS), super chip

KS D 3532-2002(2017) Corrosion－resisting and heat－resisting superalloy plates and sheets

Defense Logistics Agency, super chip

DLA DSCC-DWG-07016-2007 CAPACITOR, FIXED, TANTALUM CHIP, WEIBULL GRADED, LOW ESR
DLA SMD-5962-07218 REV A-2008 MICROCIRCUIT, LINEAR, RADIATION HARDENED, ULTRA HIGH FREQUENCY, NPN-PNP COMBINATION TRANSISTOR ARRAY, MONOLITHIC SILICON
DLA SMD-5962-97509 REV B-2003 MICROCIRCUIT, LINEAR, MICROPOWER SUPPLY VOLTAGE SUPERVISORS, MONOLITHIC SILICON
DLA SMD-5962-88596 REV D-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, BUFFER/DRIVER, MONOLITHIC SILICON
DLA SMD-5962-88589 REV D-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, POSITIVE NAND GATE, MONOLITHIC SILICON
DLA SMD-5962-88625 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ALS SCHOTTKY TTL, QUADRUPLE, 1 OF 2 DATA SELECTORS/MULTIPLEXERS, MONOLITHIC SILICON
DLA SMD-5962-88591 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, INVERTING, OCTAL BUFFER AND LINE DRIVER WITH THREESTATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-04228-2004 MICROCIRCUITS, DIGITAL, ADVANCED CMOS, UP/DOWN BINARY COUNTER WITH PRESET AND RIPPLE CLOCK, TTL COMPLATIBLE INPUTS, MONOLITHIC SILICON

International Organization for Standardization (ISO), super chip

ISO 22278:2020 Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for crystalline quality of single-crystal thin film (wafer) using XRD method with parallel X-ray beam

British Standards Institution (BSI), super chip

20/30360821 DC BS ISO 22278. Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for crystalline quality of single-crystal thin film (wafer) using XRD method with parallel X-ray beam

German Institute for Standardization, super chip

DIN 86266:2006 Ships and marine technology - Butterfly valves for flanges extra light duty wafer type and flanged type - DN 50 to DN 125, PN 10

Society of Automotive Engineers (SAE), super chip

SAE AS7928/11-2007 Terminal, Lug, Crimp Style, copper, Uninsulated, Ring Tongue, Tin Whisker Resistant, Type I, Class I, for 175 °C Total conductor Temperature
SAE AS7928/9-2007 TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER, INSULATED, RECTANGULAR TONGUE, TIN WHISKER RESISTANT FOR THIN WALL WIRE, TYPE II, CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

SAE - SAE International, super chip

SAE AS7928/11C-2015 Terminal, Lug, Crimp Style, copper, Uninsulated, Ring Tongue, Tin Whisker Resistant, Type I, Class I, for 175 °C Total conductor Temperature
SAE AS7928/11B-2011 TERMINAL@ LUG@ CRIMP STYLE@ COPPER@ UNINSULATED@ RING TONGUE@ TIN WHISKER RESISTANT@ TYPE I@ CLASS I@ FOR 175 °C TOTAL CONDUCTOR TEMPERATURE
SAE AS7928/11A-2010 TERMINAL@ LUG@ CRIMP STYLE@ COPPER@ UNINSULATED@ RING TONGUE@ TIN WHISKER RESISTANT@ TYPE I@ CLASS I@ FOR 175 °C TOTAL CONDUCTOR TEMPERATURE
SAE AS7928/9A-2016 TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER, INSULATED, RECTANGULAR TONGUE, TIN WHISKER RESISTANT FOR THIN WALL WIRE, TYPE II, CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

Professional Standard - Chemical Industry, super chip

HG/T 3173-2002 Fabrication and inspection method for High pressure urea equipment intergranular corrosion trend test on the urea grade extra low carbon Cr-Ni-Mo austenitic stainless steel
HG/T 3172-2002 Fabrication and inspection method for High pressure urea equipment preparation of the test coupons for the intergranular corrosion trend test on the urea grade extra low carbon Cr-Ni-Mo austenitic stainless steel