共找到 1197 条与 半导体分立器件综合 相关的标准,共 80 页
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices
Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.
Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Nanotechnologies - Determination of elemental impurities in samples of carbon nanotubes using inductively coupled plasma mass spectrometry
Semiconductor devices. Mechanical and climatic test methods. Steady-state temperature humidity bias life test
Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
Electronic components - Long-term storage of electronic semiconductor devices. - Part 2: Deterioration mechanisms
This part of IEC 60286 applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling, insertion and other operations, and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
Nanotechnologies - Characterization of multiwall carbon nanotubes - Mesoscopic shape factors
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016
Nanotechnologies - Characterization of single-wall carbon nanotubes using ultraviolet-visible-near infrared (UV-Vis-NIR) absorption spectroscopy
Semiconductor devices - Semiconductor devices for energy harvesting and generation. - Part 3: Vibration based electromagnetic energy harvesting
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
This part of IEC 62951 specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates. Conductive thin films on flexible substrates are extensively used in flexible electronic devices and flexible semiconductors. Conductive thin films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film. The electrical and mechanical behaviours of thin films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions and adhesion between the film and substrate. The object of this standard is to establish simple and repeatable test methods for evaluating the electromechanical properties or flexibility of conductive thin films on flexible substrate. The bending test methods include outer bending test and inner bending test.
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. This test method is considered destructive.
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Semiconductor devices -- Micro-electromechanical devices -- Part 1: Terms and definitions
The purpose of this part of IEC 60749 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43.
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
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