L40 半导体分立器件综合 标准查询与下载

JIS C 6790:2016 螺栓夹紧式朗之万(Langevin)振动器使用功率表法的负荷试验

Load test of a bolt-clamped Langevin vibrator using wattmeter method

SJ/T 11586-2016 半导体器件10KeV低能X射线总剂量辐照试验方法

Test method for 10KeV low-energy X-ray total dose irradiation of semiconductor devices

IEC 62047-26:2016 半导体器件. 微型机电装置. 第26部分: 微槽和针孔结构的描述和测量方法

This part of IEC 62047 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

IEC 62047-1:2016 半导体装置.微型机电装置.第1部分:术语和定义

This part of IEC 62047 defines terms for micro-electromechanical devices including the process of production of such devices.

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

JIS C 5630-20:2015 半导体器件. 微型机电装置. 第20部分: 陀螺仪

Semiconductor devices -- Micro-electromechanical devices -- Part 20: Gyroscopes

IEC/IEEE 62659:2015 纳米制造. 纳米电子学的大规模生产

Nanomanufacturing - Large scale manufacturing for nanoelectronics

BS EN 62047-17:2015 半导体器件. 微型机电装置. 用于测量薄膜力学性能的胀形试验方法

Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films

BS EN 62047-16:2015 半导体器件. 微型机电装置. 用于测定MEMS薄膜晶片曲率剩余应力的试验方法和悬臂梁挠度法

Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflection methods

BS EN 62047-15:2015 半导体器件. 微型机电装置. PDMS和玻璃之间的粘结强度的试验方法

Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass

BS PD CLC/TR 62258-4:2013 半导体芯片产品. 对芯片用户和供应商的问卷调查

Semiconductor die products. Questionnaire for die users and suppliers

BS EN 62047-22:2014 半导体器件. 微型机电装置. 柔性基板上导电薄膜机电拉伸试验方法

Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates

BS EN 60749-42:2014 半导体器件. 机械和气候试验方法. 温度和湿度存储

Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage

BS EN 62047-21:2014 半导体器件. 微型机电装置. 薄膜MEMS材料泊松比试验方法

Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials

BS EN 62047-20:2014 半导体器件. 微型机电装置. 陀螺仪

Semiconductor devices. Micro-electromechanical devices. Gyroscopes

DIN EN 60749-26:2014 半导体器件.机械和气候试验方法.第26部分:静电放电(ESD)灵敏度试验.人体模型(HBM)(IEC 60749-26-2013).德文版本EN 60749-26-2014

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2013); German version EN 60749-26:2014

BS IEC 62860-1:2013 基于有机晶体管的环形振荡器特性的试验方法

Test methods for the characterization of organic transistor-based ring oscillators

BS IEC 62860:2013 有机晶体管和材料特性的试验方法

Test methods for the characterization of organic transistors and materials

NF C96-013-4*NF EN 60191-4:2014 半导体装置的机械标准化.第4部分:半导体装置封装外部形状的分类和编码系统

Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages

BS EN 60749-26:2014 半导体器件.机械和气候试验方法.静电放电(ESD)灵敏度测试.人体模型(HBM)

Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)

IEC 62047-22:2014 半导体器件. 微型机电装置. 第22部分: 柔性基板上导电薄膜机电拉伸试验方法

This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS@ consumer products@ and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate@ whereas all other dimensions are similar to each other.

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates