L55 微电路综合 标准查询与下载

DB44/T 1903-2016 线路板特性阻抗测试方法 时域反射法

Circuit Board Characteristic Impedance Test Method Time Domain Reflectometry

BS IEC 62899-201:2016 印刷电子技术. 材料. 基板

Printed electronics. Materials. Substrates

BS IEC 62899-202:2016 印刷电子技术. 材料. 导电油墨

Printed electronics. Materials. Conductive ink

DIN IEC/TS 62132-9:2015 集成电路.电磁抗干扰测量.第9部分:辐射抗扰度测量.表面扫描法 (IEC/TS 62132-9-2014)

Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method (IEC/TS 62132-9:2014)

IEEE 1801/COR-2014 低功率集成电路设计和验证用IEEE标准.勘误

Errata to Design and Verification of Low-Power Integrated Circuits (IEEE Computer Society)

IEEE 1801A-2014 低功率集成电路设计和验证用IEEE标准.修改件1

Design and Verification of Low-Power Integrated Circuits-Amendment 1 (IEEE Computer Society)

JIS X 6905:2013 集成电路卡.使用持卡人优先接口的增强型终端可及性

Integrated circuit cards -- Enhanced terminal accessibility using cardholder preference interface

BS EN 62215-3:2013 集成电路.脉冲抗干扰度测量.第3部分:非同步瞬时注射法

Integrated circuits. Measurement of impulse immunity. Non-synchronous transient injection method

IEC 62215-3:2013 集成电路.脉冲抗干扰度测量.第3部分:非同步瞬时注射法

Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method

NF C86-222*NF EN 190109:2013 系列规范:数字集成HC MOS电路.HC/HCT/HCU系列

Family specification : Digital Integrated HC MOS Circuits - Series HC/HCT/HCU

ANSI/VITA 58.1-2013 现场可置换集成电子底盘标准.液体冷却底盘

Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis

IEEE 1149.1-2013 测试存取口及边界扫描结构用IEEE标准

IEEE Standard for Test Access Port and Boundary-Scan Architecture

DIN IEC/TS 62132-9:2012 集成电路.电磁抗干扰测量.第9部分:辐射抗扰度测量.表面扫描法(IEC 47A/887/CD-2012)

Integrated circuits - measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method (IEC 47A/887/CD:2012)

IEC 47A/880/CD:2012 集成电路.电磁发射的测量.第3部分:辐射发射的测量.表面扫描法

Integrated Circuits - Measurement of Electromagnetic Emissions - Part 3: Measurement of radiated emissions - Surface scan method

ANSI/ATIS 0600020.a-2012 无铅电路组件免测试条件

Pb-Free Circuit Pack Testing Waive Conditions

ANSI/ASTM D3380:2010 塑料片基微波电路基片的相对透电率(介电常数)和耗散因数测试方法

Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Plastic-based Microwave Circuit Substrates

ANSI/ATIS 0600020-2010 无铅电路组装的试验要求

Test Requirements for Pb-free Circuit Packs

ASTM D3380-10 基于聚合物的高频电路基质的相对电容率(介电常数)和损耗因子的标准试验方法

Permittivity and dissipation factor are fundamental design parameters for design of microwave circuitry. Permittivity plays a principal role in determining the wavelength and the impedance of transmission lines. Dissipation factor (along with copper losses) influence attenuation and power losses. This test method is suitable for polymeric materials having permittivity in the order of two to eleven. Such materials are popular in applications of stripline and microstrip configurations used in the 1 to 18 GHz range. This test method is suitable for design, development, acceptance specifications, and manufacturing quality control. Note 28212;See Appendix X1 for additional information regarding significance of this test method and the application of the results.1.1 This test method permits the rapid measurement of apparent relative permittivity and loss tangent (dissipation factor) of metal-clad polymer-based circuit substrates in the X-band (8 to 12.4 GHz). 1.2 This test method is suitable for testing PTFE (polytetrafluorethylene) impregnated glass cloth or random-oriented fiber mats, glass fiber-reinforced polystyrene, polyphenyleneoxide, irradiated polyethylene, and similar materials having a nominal specimen thickness of 1/16 in. (1.6 mm). The materials listed in the preceding sentence have been used in commercial applications at nominal frequency of 9.6 GHz. Note 18212;See Appendix X1 for additional information about range of permittivity, thickness other than 1.6 mm, and tests at frequencies other than 9.6 GHz. 1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates

IEC 60747-5-2:2009 分立半导体器件及集成电路.第5-2部分:光电元件.基本额定值及特性

Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics

IEC 60747-5-3:2009 分立半导体器件及集成电路.第5-3部分:光电元件.测量方法

Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods