共找到 926 条与 微电路综合 相关的标准,共 62 页
本标准规定了半导体集成电路存储器的引出端排列。 本标准适用于半字节动态存储器、字宽动态存储器、字节宽动态存储器、半字节同步动态存储器.字节宽同步动态存储器、.字宽同步动态存储器的引出端排列。 长
Integrated circuits—Memory devices pin configuration
本标准规定了焊柱阵列(CGA)的试验方法。 本标准适用于采用焊柱阵列(CGA)封装形式的集成电路(以下简称器件),焊柱包括高铅焊柱、微线圈焊柱、铜带缠绕型焊柱、基板增强型焊柱、镀铜焊柱等。
Integrated circuits.Test methods for column grid array
本标准规定了MEMS电场传感器(以下简称“传感器”)的原材料、结构组成、技术要求、试验项目和方法、检验规则、包装、存储和运输。 本标准适用于MEMS电场传感器的研制、生产和采购。其他类型的电场传感器可参照使用。
General specification for MEMS electric field sensor
Semiconductor die products—Part 7: XML schema for data exchange
Semiconductor die products—Part 1:Requirements for procurement and use
Semiconductor die products—Part 6: Requirements for concerning thermal simulation
Semiconductor die products—Part 4: Requirements for die users and suppliers
Semiconductor die products—Part8: EXPRESS model schema for data exchange
Semiconductor die products—Part 3: Guide for handling, packing and storage
Semiconductor die products—Part 5:Requirements for concerning electrical simulation
Test methods for flip chip integrated circuits
Semiconductor die products—Part 2: Exchange data formats
Micro electromechanical system technology—Test method for the nonlinear vibration of the MEMS resonant sensitive element
Micro-electromechanical system technology—Measuring method for in-plane length measurements of MEMS microstructures using an optical interferometer
Micro-electromechanical system technology—Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer
Micro-electromechanical system technology—Measuring method of microstructure surface stress based on Raman spectroscopy
Micro-electromechanical system technology—Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer
Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances
Test methods of the performance for MEMS high g accelerometer
本标准规定了采用以深刻蚀与键合为核心的工艺集成进行MEMS器件加工时应遵循的工艺要求和质量检验要求。 本标准适用于基于以深刻蚀与键合为核心的工艺集成的加工和质量检验。
Silicon-based MEMS fabrication technology.Specification for criterion of the combination of the deep etching and bonding process
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