This document specifies a molded stress relief deformation test. This document applies to electrotechnical equipment containing parts made of polymeric materials. This test method is mainly used to evaluate the effect of stress relief on the residual process of finished molded polymer components. Stress relief occurs when the specimen (energized or not) is exposed to a specified temperature for a certain period of time. If the sample meets the specified test standard after conditioning at room temperature, it is considered to have passed the test. This document is intended for use by technical committees preparing standards in accordance with the principles set out in IEC Guide 104 and ISO/IEC Guide 51. One of the tasks of technical committees is to use this series of standards wherever applicable when preparing standards in this field. Unless specifically mentioned or listed in the relevant standards, the requirements, test methods or test conditions of this document will not apply.