This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).
DS/EN 60749-30-2005由丹麦标准化协会 DK-DS 发布于 2005-05-27,并于 2005-05-27 实施。
DS/EN 60749-30-2005在国际标准分类中归属于: 31.080.01 半导体器分立件综合。
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