DS/EN 60749-14-2004

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)


说明:

  • 此图仅显示与当前标准最近的5级引用;
  • 鼠标放置在图上可以看到标题编号;
  • 此图可以通过鼠标滚轮放大或者缩小;
  • 表示标准的节点,可以拖动;
  • 绿色表示标准:DS/EN 60749-14-2004 , 绿色、红色表示本平台存在此标准,您可以下载或者购买,灰色表示平台不存在此标准;
  • 箭头终点方向的标准引用了起点方向的标准。

 

 

非常抱歉,我们暂时无法提供预览,您可以试试: 免费下载 DS/EN 60749-14-2004 前三页,或者稍后再访问。

点击下载后,生成下载文件时间比较长,请耐心等待......

 



标准号
DS/EN 60749-14-2004
发布日期
2004年03月15日
实施日期
2003年12月22日
废止日期
国际标准分类号
31.080.01
发布单位
DK-DS
适用范围
This part of IEC 60749 provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. For hermetic packages, it is recommended that this test be followed by hermeticity tests in accordance with IEC 60749-8 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. This test, including each of the test conditions, is considered destructive and is only recommended for qualification testing. This standard is applicable to all through-hole devices and surface-mount

DS/EN 60749-14-2004系列标准





Copyright ©2007-2022 ANTPEDIA, All Rights Reserved
京ICP备07018254号 京公网安备1101085018 电信与信息服务业务经营许可证:京ICP证110310号