DS/EN 60749-14-2004

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

DS/EN 60749-14-2004 发布历史

This part of IEC 60749 provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. For hermetic packages, it is recommended that this test be followed by hermeticity tests in accordance with IEC 60749-8 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. This test, including each of the test conditions, is considered destructive and is only recommended for qualification testing. This standard is applicable to all through-hole devices and surface-mount

DS/EN 60749-14-2004由丹麦标准化协会 DK-DS 发布于 2004-03-15，并于 2003-12-22 实施。

DS/EN 60749-14-2004在国际标准分类中归属于: 31.080.01 半导体器分立件综合。

DS/EN 60749-14-2004的历代版本如下：

• 2004年03月15日 DS/EN 60749-14-2004

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标准号

DS/EN 60749-14-2004

发布日期

2004年03月15日

实施日期

2003年12月22日

废止日期

无

国际标准分类号

31.080.01

发布单位

DK-DS

适用范围

This part of IEC 60749 provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. For hermetic packages, it is recommended that this test be followed by hermeticity tests in accordance with IEC 60749-8 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. This test, including each of the test conditions, is considered destructive and is only recommended for qualification testing. This standard is applicable to all through-hole devices and surface-mount

DS/EN 60749-14-2004系列标准