DS/EN 60749-15-2011

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices


 

 

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标准号
DS/EN 60749-15-2011
发布日期
2011年02月24日
实施日期
2011年02月24日
废止日期
国际标准分类号
31.080.01
发布单位
DK-DS
被代替标准
DS/EN 60749-15-2003
适用范围
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.

DS/EN 60749-15-2011系列标准





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