IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.
DS/EN 60749-15-2011由丹麦标准化协会 DK-DS 发布于 2011-02-24,并于 2011-02-24 实施。
DS/EN 60749-15-2011在国际标准分类中归属于: 31.080.01 半导体器分立件综合。
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