IEC 62047-15-2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (Edition 1.0)
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 15: Méthode d'essai de la résistance de collage entre PDMS et verre (Edition 1.0)
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (Edition 1.0) 是非强制性国家标准，您可以免费下载前三页
This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber@ PDMS@ is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer@ one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also@ in case of systems having pneumatic microvalves@ a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas@ which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip